Category Archives: IPC

IPC 4101E

Specification for Base Materials for Rigid and Multilayer Printed Boards

Published by: 2015-07-01 / 2015-07-01 / 172 pages
IPC 4101E covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 64 individual specification sheets that can be searched using keywords. These keywords allow the document’s user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. The E revision includes six specification sheets which reflect the expanded offerings for current commercially available laminates and prepregs with improved or additional properties that are one or more of the following: low-halogen content, high-thermal performance, high speed/high frequency performance or thermally conductivity.

Ordering and availability

This publication is available only in printed edition.

IPC 4202B

Flexible Base Dielectrics for Use in Flexible Printed Boards

Published by: 2016-12-01 / 2016-12-01 / 40 pages
IPC 4202B provides comprehensive data to help users more easily determine both material capability and compatibility for flexible base dielectric materials for manufacture of flexible printed boards. It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system, qualification and quality conformance requirements, including high frequency dielectric properties. A new specification sheet for an adhesive fluorocarbon film has been added as it became available to the marketplace.

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This publication is available only in printed edition.

IPC 7530A

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

Published by: 2017-03-01 / 2017-03-01 / 52 pages
IPC 7530A provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling.

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This publication is available only in printed edition.

IPC A-610F-WAM1

Acceptability of Electronic Assemblies – Incorporates Amendment 1

Published by: 2016-02-01 / 2016-02-01
IPC-A-610F with Amendment 1 incorporates the requirements of IPC-A-610F and IPC-A-610F Amendment 1 into one document. Criteria are presented in a seamless IPC-A-610 format, and there are no redline marks. This document is the equivalent to using IPC-A-610F and IPC-A-610F Amendment 1. IPC brings this version to industry to minimize confusion for those using both documents and those wishing to update their documentation with the latest available format.

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding – all without eleminating any requirements.

Major topics include:

  • flex attachment,
  • board-in-board,
  • part-on-part,
  • both lead-free and tin-lead criteria,
  • component orientation and soldering criteria for through hole,
  • SMT,
  • cleaning, marking, coating and laminate requirements.

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria – 86 of them new or updated. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001.

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This publication is available only in printed edition.

IPC D-640

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

Published by: 2016-06-01 / 2016-06-01 / 100 pages
This full-color document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. This standard also includes an Excel spreadsheet Verification and Compliance checklist.

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This publication is available only in printed edition.

IPC 9691B

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

Published by: 2016-06-01 / 2016-06-01 / 48 pages
This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding implementation of the User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing to evaluate the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination and other material processing characteristics on formation of conductive paths within laminate material such as conductive anodic filaments (CAF), one specific type of ECM failure mode. This internal ECM test method provides a proven standard for determining the risk of through-hole bias and other internal conductor orientations that result in significant reduction of insulation resistance internally, rather than on the surface of printed boards.

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This publication is available only in printed edition.

IPC 9252B

Requirements for Electrical Testing of Unpopulated Printed Boards

Published by: 2016-09-01 / 2016-09-01 / 28 pages
PC-9252 defines levels of appropriate testing and assists in the selection of the test analyzer, test parameters, test data and fixturing required to perform electrical test(s) on unpopulated printed boards and innerlayers. Revision B provides new requirements for resistive and indirect continuity and isolating testing, test record marking and traceability and an updated sample electrical test certificate of conformance (C of C).

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This publication is available only in printed edition.

IPC 1072

Intellectual Property Protection in Electronic Assembly Manufacturing

Published by: 2015-12-01 / 2015-12-01 / 28 pages
The purpose of this standard is to provide requirements and best practices for EMS companies to ensure protection of intellectual property for their customers. By using this standard, EMS companies can provide their customers assurance that the intellectual property built into their circuit boards is protected. The document is also a companion to IPC-1071 for printed circuit board manufacturers.

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This publication is available only in printed edition.

IPC J-STD-001F-WAM1

Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1

Published by: 2016-04-01 / 2016-04-01 / 84 pages
J-STD-001F with Amendment 1 incorporates the requirements of J-STD-001F and J-STD-001F Amendment 1 into one document. Criteria are presented in a seamless J-STD-001 format, and there are no redline marks. This document is the equivalent to using J-STD-001F and J-STD-001F Amendment 1. IPC brings this version to industry to minimize confusion for those using both documents and those wishing to update their documentation with the latest available format.

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This publication is available only in printed edition.

IPC 6903

Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)

Published by: 2015-10-01 / 2015-10-01 / 20 pages
This standard provides industry-approved terms and definitions to create a common language for users and suppliers to develop electronics products that utilize printed electronics alone or as additive processes combined with traditional rigid, flexible and rigid-flex PWB assemblies.

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This publication is available only in printed edition.