Category Archives: TechAmerica

TechAmerica TA-HB-0009

Reliability Program Handbook

Published by: TechAmerica, Where the Future Begins (formerly ITAA/GEIA) / 04/01/2013 / 456 pages
Scope

This handbook provides “how to” guidance to industry and government for the reliability Activities and
Methods contained in ANSI/GEIA-STD-0009 for developing reliable products and systems, successfully
demonstrating them during test and evaluation, and sustaining them throughout the system/product life
cycle.

ANSI/GEIA-STD-0009 requires the developers and customer/users working as a team to plan and
implement a reliability program that provides systems/products that satisfy the user’s requirements and
expectations using a systems engineering approach. The four Objectives of ANSI/GEIA-STD-0009 are
listed below:

  • Objective 1: Understand Customer/User Requirements and constraints. The team (developer,
    customer, and user), includes the Activities necessary to ensure that the user’s requirements and
    product needs are fully understood and defined, so that a comprehensive design specification and
    Reliability Program Plan are generated.
  • Objective 2: Design and redesign for reliability. The developer implements a set of engineering
    Activities so that the resulting system/product satisfies the customer’s documented requirements
    and needs.
  • Objective 3: Produce reliable systems/products. The developer performs the Activities that assure
    the customer that the reliability requirements and product needs have been satisfied.
  • Objective 4: Monitor and assess user reliability. The team establishes a closed-loop feedback
    method for continuous monitoring of reliability trends and incorporation of recommended
    improvements (corrective actions).

ANSI/GEIA-STD-0009 and this Handbook define a systematic approach to engineering a system/product,
incorporating best practices that have evolved considerably in recent years.
Figure 1.1-1 shows the four objectives, defined in Section 1.4.2 of ANSI/GEIA-STD-0009, and is a
defense industry example of the interaction of the Objectives, supporting Activities and Methods, and
strategies for reliable system design in the acquisition cycle.

Ordering and availability

This publication is available both in printed and PDF edition.

TechAmerica GEIA-STD-0007-B

Logistics Product Data

Published by: TechAmerica, Where the Future Begins (formerly ITAA/GEIA) / 07/01/2013
This standard defines logistics product data generated during the requirements definition and
design of an industry or government system, end item or product. It makes use of the Extensible
Markup Language (XML) through the use of entities and attributes that comprise logistics
product data and their definitions. The standard is designed to provide users with a standard set
of data tags for all or portions of logistics product data and customer defined sub-sets of logistics
product data.

Ordering and availability

This publication is available both in printed and PDF edition.

TechAmerica GEIA-STD-0005-3-REV A

Performance Testing for Aerospace and High Performance Electronic Interconnects Containing PB-free Solder and Finishes

Published by: TechAmerica, Where the Future Begins (formerly ITAA/GEIA) / 12/01/2012 / 56 pages
This document defines

1. a default method for those companies that require a pre-defined approach and

2. a protocol for those companies that wish to develop their own test methods.

This document addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing Pb-free solder. One failure mode, fatigue-failure through the solder-joint, is considered a primary failure mode in AHP electronics and can be understood in terms of physics-of-failure and life-projections. Understanding the all potential failure modes caused by Pb-free solder of AHP electronics is a critical element in defining early field-failures/reliability issues. Grouping of different failure modes may result in incorrect and/or misleading test conclusions. Failure analysis efforts should be conducted to insure that individual failure modes are identified enabling the correct application of reliability assessments and life projection efforts.

Ordering and availability

This publication is available both in printed and PDF edition.

TechAmerica GEIA-STD-0005-3-REV A

Performance Testing for Aerospace and High Performance Electronic Interconnects Containing PB-free Solder and Finishes

TechAmerica, Where the Future Begins (formerly ITAA/GEIA) / 01-Dec-2012 / 56 pages

This document defines

1. a default method for those companies that require a pre-defined approach and

2. a protocol for those companies that wish to develop their own test methods.

This document addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing Pb-free solder. One failure mode, fatigue-failure through the solder-joint, is considered a primary failure mode in AHP electronics and can be understood in terms of physics-of-failure and life-projections. Understanding the all potential failure modes caused by Pb-free solder of AHP electronics is a critical element in defining early field-failures/reliability issues. Grouping of different failure modes may result in incorrect and/or misleading test conclusions. Failure analysis efforts should be conducted to insure that individual failure modes are identified enabling the correct application of reliability assessments and life projection efforts.

Ordering and availability

This publication is available both in printed and PDF edition.

TechAmerica TA-STD-0017

Product Support Analysis

TechAmerica, Where the Future Begins (formerly ITAA/GEIA) / 01-Nov-2012 / 60 pages

This standard establishes general principles and descriptions of activities which, when performed in a logical and iterative nature, comprise the Product Support Analysis process.

An effective Product Support Analysis program shall be established and maintained as part of the Life-Cycle Management (LCM) program. It shall be planned, integrated, developed, and conducted in conjunction with other requirement definition, design, development, production, and deployment functions to cost effectively achieve overall program objectives. The Product Support Analysis program shall be established consistent with the type and phase of the acquisition program, and procedures shall be established to assure that the Product Support Analysis program is an integral part of the system engineering process. Interfaces between the Product Support Analysis program and other system engineering programs shall be identified.

The Product Support Analysis program shall include the management and technical resources, plans, procedures, schedules, and controls for the performance of Product Support Analysis
requirements.

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This publication is available both in printed and PDF edition.

TechAmerica HB-0009 Ballot Draft

HB-0009 Ballot draft document – Reliability Program Handbook

TechAmerica, Where the Future Begins (formerly ITAA/GEIA) / 30-Oct-2012 / 454 pages

This is a ballot draft document. Please send any comments to standards@techamerica.org no later than 11/30/12 11:59 PM Eastern Time.

Please use this form (Microsoft Excel spreadsheet) when submitting comments.

Ordering and availability

This publication is available both in printed and PDF edition.