Performance Testing for Aerospace and High Performance Electronic Interconnects Containing PB-free Solder and Finishes
This document defines
1. a default method for those companies that require a pre-defined approach and
2. a protocol for those companies that wish to develop their own test methods.
This document addresses the evaluation of failure mechanisms, through performance testing, expected in electronic products containing Pb-free solder. One failure mode, fatigue-failure through the solder-joint, is considered a primary failure mode in AHP electronics and can be understood in terms of physics-of-failure and life-projections. Understanding the all potential failure modes caused by Pb-free solder of AHP electronics is a critical element in defining early field-failures/reliability issues. Grouping of different failure modes may result in incorrect and/or misleading test conclusions. Failure analysis efforts should be conducted to insure that individual failure modes are identified enabling the correct application of reliability assessments and life projection efforts.